Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
New surface mounting and packaging technologies, using self-assembly with chips having cavity structures, were investigated for three-dimensional (3D) and hetero integration of complementary metal-oxide semiconductors (CMOS) and microelectromechanical systems (MEMS).By the surface tension rumchata proof of small droplets of 0.5 wt% hydrogen fluorid